CMOS Integration of Capacitive, Optical, and Electrical Interconnects

We present a 90 nm test chip integrating proximity communication, optics using external lasers and photodiodes, and CML electronics on a single CMOS chip which can route data at multi-Gb/s rates through any combination of its three interconnect interfaces. A robust and flexible unclocked datapath allows independent timing and margin characterization of each path. Proximity communication provides a high-bandwidth, high-density channel between two chips.

CMOS Integration of Capacitive, Optical, and Electrical Interconnects