December 12, 2016 – Twenty sixteen was yet another outstanding year to be a participant and spectator in the CMOS image sensor (CIS) marketplace – with significant advancements in devices and architectures. Read more

January 12, 2015 – With an estimated 13 billion electronic devices already connected to the Internet, interest in the potential explosive growth of the Internet of Things (IoT) market has greatly increased and attracted a large amount of technology investment. Read more

January 9, 2015 – In 2015, Forza Silicon (www.forzasilicon.com) will be celebrating its 14th year in the business of delivering innovative custom CMOS image sensor (CIS) and IC design solutions. The business success that we have enjoyed over those years is a reflection of our continued emphasis on innovation and problem solving. Read more

January 6, 2015 – As the number of devices connected to the Internet is expected to grow to more than 50 billion devices by 2020, this interconnected network of sensors—described as the Internet of Things (IoT)—has become the focus of a number of leading technology companies. Read more

December 3, 2014 – The future is now. But for one person you know, the future was yesterday. They don’t wear shoes; they wear RocketSkates. The first thing they do when they buy a Galaxy phone is turn the eye-tracking feature on. Read more

October 29, 2014 – Two topics that are currently receiving a lot of attention are the Internet of Things (IoT) and the deployment of numerous sensors. Of particular interest is the concept of smart sensors and “processing on the edge.” Consider the case of a sensor that detects whether or not someone is in a room, and uses this information to activate or dim the lights, for example. Read more

October 29, 2014 – Video tech developer Forza Silicon has announced a new image sensor offering a great degree of customization. Forza says it’s the world’s first image sensor offering total reconfiguration and programmability in a single chip.  Read more

October 2014 – To increase the dynamic range of their imagers, sensor manufacturers are incorporating a number of novel techniques In many industrial and automotive applications, it is necessary to capture images that may simultaneously contain very bright and very dark components. Read more

September 15, 2014 – CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However this is not really the case. Shellcase MVP, the first generation of CIS that used through silicon vias (TSVs) to form interconnects was still a 2D device. Read more