Experience

 

Image Sensor Designs
Design examples of CMOS Image Sensor success stories.

 

High Speed Designs
Design examples of High Speed Communication & Optoelectronic success stories.

 

Mixed Signal Designs
Design examples of Mixed Signal success stories.

 

Foundries
Experience with numerous Foundries and process technologies.

 

Intellectual Property
Patents and Innovations.

 
 

 

CMOS Image Sensor (CIS) Designs

32 Mpixel CIS for Studio Camera

  • FORZ-HD™ Technology
  • 3.8µm square pixels
  • 60 frames/second operation
  • On-Chip Column Parallel ADC(s)
  • Programmable Pre-ADC Gain
  • LVDS Digital Output
  • Approximately 35mm Format
  • 32.6mm x 25.6mm with pads
  • 1.8V logic supply
  • 3.3V analog supply
  • 2.5V I/O supply
  • Tower 0.18µm CIS process

2.1 Mpixel CIS for Cell Phone

  • 3.0µm square pixels
  • 1.8V logic supply
  • 2.5V analog supply
  • 2.5V - 3.3V I/O supply
  • 6.3mm x 5.4mm with pads
  • Pipelined 10-bit ADCs
  • 15 frames/second operation
  • 85mW Power Consumption
  • Fully programmable via serial interface
  • IBM 0.18um CIS process

10.25 Mpixel Stitched CIS for Radiography

  • Six (6) Repeating Segments
  • 30µm square pixels
  • 854H x 1200V
  • 2 MHz pixel clock rate
  • 3 mV/e- Conversion Gain
  • 4 mV/second Dark Current
  • 3.3V supply
  • On chip voltage and current bias generation
  • Start of Exposure Detection Circuitry
  • Fully programmable via serial interface
  • Optimized for high sensitivity and low crosstalk
  • Tower 0.5µm CIS process with Stitching

 

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