December 13, 2016 – Pasadena, CA – Forza Silicon (www.forzasilicon.com), a leader of advanced image sensor and mixed-signal IC designs for digital camera applications, today announced that its president, Barmak Mansoorian, will present at the 2016 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference in San Francisco, California on December 14, 2016.
Barmak Mansoorian will present a talk titled “3D Integrated Image Sensor: Options for the Fabless.” The presentation discusses the benefits, challenges and opportunities of stacked CMOS image sensors (CIS). Stacked sensor design technology was once a new concept and has since been proven viable in mass consumer electronics in the last two years.
The most obvious benefit of stacking is a smaller footprint for the CIS and processor combo. However, stacking still faces some specific challenges starting with higher non-recurring engineering (NRE) costs and limited technology processes available to select customers. The added complexities during characterization, qualification, and production will require customers to carefully consider design choices. The presentation will describe how Forza is addressing the challenges by developing custom stacking flows involving intelligent design choices and good product engineering.
“Forza Silicon has been working on stacked CMOS image sensors since 2011 as part of the DARPA SCENICC Program and other DoD initiatives,” said Dr. Barmak Mansoorian. “Stacked sensor design is something we believe will dominate advances in the CIS marketplace for the next 3 to 5 years and Forza will continue to improve image sensor design processes to help our customers take advantage of enhanced technology options.”
Forza Silicon (Pasadena, CA – www.forzasilicon.com) is a privately-held, global leader in fabless semiconductor design, specializing in analog/mixed-signal and highly sensitive, advanced CMOS image sensors for visible and infrared digital camera applications. Forza Silicon’s Custom IC Design and Integrated Production Services model offers a complete end-to-end solution from circuit design to the delivery of highly reliable production parts. Our consultative approach with clients, combined with our deep understanding of CMOS imaging technology and proven design process minimizes risk and reduces production costs, while providing state-of-the-art designs that accelerate time-to-market. Application areas include military/defense, biomedical, automotive, mobile phones, digital signage, intelligence, surveillance, and reconnaissance (ISR), digital cinematography, industrial, and more.
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